Rockchip🔲 SOC
RK3576
Built for edge inference workloads on 8nm. Delivers 6 TOPS (INT8) with 8 W.
AI Throughput
6
TOPS (INT8)
Memory Capacity
—
LPDDR4 / LPDDR4X / LPDDR5 · 64-bit
Power Draw
8
8 W
AI TOPS per Dollar
0.40 TOPS / $
Based on list price
Subject to market fluctuation
Core Identity
Fabric FoundrySamsung
Process Node8nm
Package Pins698
Package Size16.1*17.2
Release Year2024
TDP8 W
Operating Temperature0°C ~ 70°C
Reference Price$15
Main Specs — CPU / GPU / NPU / MCU
CPU
| Cluster | Core IP | Cores | Max Freq | L1 I/D per core | L2 (cluster) |
|---|---|---|---|---|---|
| 1 | Cortex-A72 | 4 | 2.2 GHz | 48 KB / 32 KB | 1 MB |
| 2 | Cortex-A53 | 4 | 1.8 GHz | 32 KB / 32 KB | 0.5 MB |
GPU
ArchitectureARM Mali-G52 MC3
Max Frequency1 MHz
NPU
VendorRockchip in-house
ArchitectureRKNN NPU (2nd-gen)
Peak Compute6 TOPS (INT8)
Supported Dtypes
INT4INT8INT16FP16
MCU
Core IPCortex-M0
Frequency400 MHz
Multimedia
| Codec | Decode (max) | Encode (max) |
|---|---|---|
| H.265 | 4K@120 | 4K@60 |
| H.264 | 4K@60 | 4K@60 |
ISP16MP ISP with HDR (up to 120dB)
Memory & Storage
Memory
Bus Width64-bit
ArchitectureExternal Discrete DRAM
Supported Types
LPDDR4LPDDR4XLPDDR5
Storage
Supported Interfaces
EMMCUFSNVMESDSPI NORSPI NANDSATA
UFS VersionUFS 2.0
External StorageNVMe via PCIe 2.1; SATA 3.1 via combo PHY
Image Input & Output
Camera Input (MIPI CSI)1x MIPI CSI-2 D-PHY (4x1 or 2x2) + 1x MIPI CSI-2 C/D-PHY (4x1) + 1x DVP 8/10/12/16-bit
HDMI1x HDMI 2.0 TX (4K@60)
MIPI DSI1x MIPI DSI 4-lane
Max Independent Displays3
Peripheral Interfaces
Ethernet2x RGMII (dual GbE)
WirelessNone on-die (via SDIO / USB)
USB1x USB 3.2 Gen1 Type-C (DP alt-mode), 2x USB 2.0 Host
PCIe1x PCIe 2.1/SATA 3.1/USB 3.2 Gen1 combo, 1x PCIe 2.1/SATA 3.1 combo
SDIO / SDSDMMC 3.0 (SDR104)
Security
Secure BootSupported
TEEARM TrustZone
Hardware Crypto
AESSHA2RSAECCTRNGOTP
Operating Systems
Supported OS
AndroidLinux (Mainline)DebianYocto / Buildroot
Android 14 SDK, Debian, Buildroot/Yocto Linux SDK